![]() ![]() Adam, Effects of temperature on the wave soldering of printed circuit boards: CFD modeling approach. Che Ani, CFD modeling of pin shape effects on capillary flow during wave soldering. Ani, Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach. ![]() Nabiałek, Investigations of infrared desktop reflow oven with FPCB substrate during reflow soldering process. Saad, Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan. Shin, Thermal response of electronic assemblies during forced convection-infrared reflow soldering in an oven with air injection. Géczy, Modelling of temperature distribution along PCB thickness in different substrates during reflow. Khor, Thermal fluid–structure interaction of PCB configurations during the wave soldering process. Whalley, A simplified reflow soldering process model. Cheok, Finite volume-based simulation of the wave soldering process: influence of the conveyor angle on pin-through-hole capillary flow. Hyslop, A simplified model of the reflow soldering process. Faizan, Dissolution of copper and formation of IMC in bulk lead-free solders. Ricky Lee, Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints. Lu, Thermal stress-strain simulation analysis of bga solder joint reflow soldering process. Lau, Fan-Out Wafer-Level Packaging, 1st ed., (Singapore: Springer, 2018), pp.21–68. Lau, Recent advances and new trends in flip chip technology. Bernier, in Advanced Flip Chip Packaging, ed. Mater.: Processes, Properties, and Interfaces, San Jose, CA, USA, 03-05 October 2007 McEwen, Characterization of a thick copper pillar bump process. Datta, Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: an overview. Henderson, Copper Pillar Bumping Technology, Semit. Chen, Micro copper pillar interconnection using thermosonic flip chip bonding. Vuppala, CFD simulation of solder paste flow and deformation behaviours during stencil printing process. (IMPACT), Taipei, Taiwan, 25-27 October 2017 Lin, Generational Changes of Flip Chip Interconnection Technology. Wu, Effects of α-Fe 2O 3 additions on assembly reliability of electroplated Sn-based solder cap on Cu pillar bump during thermal cycling. Tang, Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu. Fornaro, Thermal properties of sn-based solder alloys. Abdullah, Simulation investigations on fluid/structure interaction in the reflow soldering process of board-level BGA packaging. Khor, A review on numerical approach of reflow soldering process for copper pillar technology. The findings of this research provide valuable insights into the effects of varying Cu pillar diameters on the reflow soldering process, which can help in the development of more reliable electronic assemblies. The study also examines the effect of soldering materials on the Cu pillar bump. By coupling the thermal loads with the structural analysis using thermal FSI, Cu pillar bumps with a diameter of 0.20 mm are found to exhibit the lowest reflow temperature, minimum temperature difference, and minimum deformation and thermal stress, making them the most suitable interconnection joints for flip chip technology. A parametric study has been conducted to analyze the effect of different Cu pillar diameters on the reflow soldering process. The temperature distributions of solder and Cu pillar bumps are compared. The accuracy of the simulated reflow temperature profile has been verified by comparing it with the experimental temperature data, according to JEDEC standards. The desktop reflow oven is modeled in ANSYS FLUENT, while the ball grid array (BGA) package assembly is modeled in ANSYS STATIC STRUCTURAL. This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study the effect of different Cu pillar bump diameters on thermal and mechanical performance during the reflow soldering process.
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